StarTech.com Thermal Paste, Pack of 5 Syringes (1.5g/ea), Metal Oxide Heat Sink Compound, CPU Paste

Thermal Paste 5 Pack – 5-pack of 1.5g metal oxide based thermal grease/glue compound – works wheat sink to improve heat dissipation from CPUs/GPUs and other integrated computer chips – High performance silver paste operates in temperatures of -22F to 365F (-30C to 180C) – Re-sealable syringe prevents drying – 5-Pack ideal for multi workstation distribution 4-6 applications per tube for 20-30 applications in total – Thermal conductivity of 3.07 W/m-K at 25 C or greater – CE and RoHs Certified TAA Compliant.

5-pack of 1.5g thermal heat paste; Metal oxide compound – 4-6 applications per tube – Operational temperatures of -22F to 365F – Thermal conductivity greater than 3.195W/m-K at 25 °C – TAA; Re-sealable syringe; Silver heat sink paste