Our thermal CPU paste improves the effectiveness of CPU coolers by thermally bonding the CPU to the heatsink – a high-quality solution that helps to ensure maximum dissipation of heat generated by the CPU.
1.5g thermal heat paste; Metal oxide compound – 4-6 applications per tube – Operational temperatures of -22F to 365F – Thermal conductivity greater than 3.195W/m-K at 25 °C – TAA; Re-sealable syringe; Silver heat sink paste

Tablet Thin EliteBook Revolve 810 G6 





